Robotics Industry News
University of Dayton: Yaskawa Motoman Continues Support of School of Engineering with Six New Robots for Motoman Robotics Lab
Yaskawa America, Inc. Posted 09/26/2017
DAYTON, Ohio — Yaskawa America Inc., Motoman Robotics Division (Yaskawa Motoman), is continuing its support of hands-on learning for engineering students by donating six state-of-the art robots for the Motoman Robotics Lab at the University of Dayton.
Yaskawa Motoman's investment includes replacing the six robots it gave the School of Engineering as part of a gift in 2008 to launch the 800-square-foot lab in Kettering Laboratories, which includes classroom space for lectures.
The school and Yaskawa Motoman plan to add another six robots to the labs after an expansion in the future.
"We are thankful for Yaskawa Motoman's continued investment in the education of the newest generation of engineering professionals who will develop the robotics of the future," said Guru Subramanyam, chair of the University of Dayton electrical and computer engineering program.
In turn, University of Dayton electrical and computer engineering faculty, staff and students will continue to work on research projects in collaboration with Yaskawa Motoman.
"Yaskawa Motoman is excited about our ongoing partnership with the University of Dayton and our latest investment of educational robotics for UD's School of Engineering. The robotic technology provided will help create new research and development opportunities and an environment for exposing, promoting and engaging students to pursue robotic career pathways," said Robert Graff, Yaskawa America Inc. Motoman Robotics Division senior manager for education.
Founded in 1989, Yaskawa Motoman is headquartered in Miamisburg, Ohio, and provides automation products and solutions for nearly every industry and robotic application to help customers compete worldwide. There are more 360,000 Motoman® robots in-use globally for various applications, including arc welding, assembly, coating, dispensing, material handling, material cutting, material removal, packaging, palletizing and spot welding.