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Robotics Industry News

Robotic Machine Tending for Dual Sputter Deposition System

Saber Engineering, Inc.

Overview – Robotic Machine Tending for Dual Sputter Deposition SystemRobotic Machine Tending for Dual Sputter Deposition System

Saber Engineering designs and deploys a pick and place robotic system that primarily loads and unloads 500 x 500 x 0.8 mm substrates into a pair of deposition chambers.  The system utilizes a Staubli RX160L 6-axis robot to manipulate the substrates.  The entire cell is housed in a class 100 cleanroom.  The system is extremely mission critical in the handling of the substrates since each wafer may be valued at over $70k each.  Allowing the system to drop or damage a wafer is unacceptable.  Therefore Saber was tasked with designing end-of-arm-tooling for the robot that would be not only full-proof but could also fit within the constraints of all the peripheral tooling.  Complete custom tooling was designed for all elements of material handling, from part introduction to loading the deposition chambers.  System used ATI tool changer for multiple EOAT.  Machine vision guidance is utilized to maneuver the robot for loading the substrates into the chambers.  RFID is used to identify the cassettes of substrates as they enter and exit the cell.  A Supervisory Control and Data Acquisition (SCADA) oversees the operation of the system and communicates with the plant metrics for production monitoring.

  • Staubli Robotics RX160L CS8C Robot System
  • Cognex Insight Vision PlatformRobotic Machine Tending for Dual Sputter Deposition System
  • EMS Colbalt RFID Reader
  • ATI QC-20 Robot Tool Changer
  • Wonderware Intouch SCADA
  • Rockwell Compact Logic PLC
  • Siemens AC Drives

Robotic Machine Tending for Dual Sputter Deposition System

 

 

 

 

 

Robotic Machine Tending for Dual Sputter Deposition System

 

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